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1 Ergebnisse
1
A Computational Framework on Pinhole Damage in Ultrathin Ba..:
, In:
2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
,
Diyaroglu, Cagan
;
Mohammadi Anaei, Mohammad Taghi
;
Kim, Kyungjin
- p. 1-3 , 2023
Link:
https://doi.org/10.1109/EPEPS58208.2023.10314886
RT T1
2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
: T1
A Computational Framework on Pinhole Damage in Ultrathin Barriers for Flexible Electronics Encapsulation
UL https://suche.suub.uni-bremen.de/peid=ieee-10314886&Exemplar=1&LAN=DE A1 Diyaroglu, Cagan A1 Mohammadi Anaei, Mohammad Taghi A1 Kim, Kyungjin YR 2023 SN 2165-4115 K1 Encapsulation K1 Films K1 Polymers K1 Flexible electronics K1 Substrates K1 Monitoring K1 Organic electronics K1 pinhole defects K1 finite element analysis K1 water vapor transmission rates K1 inorganic thin film barriers K1 flexible organic electronics encapsulation SP 1 OP 3 LK http://dx.doi.org/https://doi.org/10.1109/EPEPS58208.2023.10314886 DO https://doi.org/10.1109/EPEPS58208.2023.10314886 SF ELIB - SuUB Bremen
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