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System Aware Floorplanning for Chip-Package Co-design:

, In: 2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS),
Pan, Tse-Han ; Franzon, Paul D. ; Srinivas, Vaishnav.. - p. 1-3 , 2023
Link: https://doi.org/10.1109/EPEPS58208.2023.10314897