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1 Ergebnisse
1
System Aware Floorplanning for Chip-Package Co-design:
, In:
2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
,
Pan, Tse-Han
;
Franzon, Paul D.
;
Srinivas, Vaishnav
.. - p. 1-3 , 2023
Link:
https://doi.org/10.1109/EPEPS58208.2023.10314897
RT T1
2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
: T1
System Aware Floorplanning for Chip-Package Co-design
UL https://suche.suub.uni-bremen.de/peid=ieee-10314897&Exemplar=1&LAN=DE A1 Pan, Tse-Han A1 Franzon, Paul D. A1 Srinivas, Vaishnav A1 Nagarajan, Mahalingam A1 Popovic, Darko YR 2023 SN 2165-4115 K1 Bridges K1 White spaces K1 Physical design K1 Electronics packaging K1 Floorplanning K1 Chip-package co-design SP 1 OP 3 LK http://dx.doi.org/https://doi.org/10.1109/EPEPS58208.2023.10314897 DO https://doi.org/10.1109/EPEPS58208.2023.10314897 SF ELIB - SuUB Bremen
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