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HBM3 PPA Performance Evaluation by TSV Model with Micro-Bum..:

, In: 2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS),
Huang, Li-Hsin ; Cheng, Yu-Ying ; Wu, Tzong-Lin - p. 1-3 , 2023
Link: https://doi.org/10.1109/EPEPS58208.2023.10314903