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Method of Exploring HVM Process Corner Cases for Loss and I..:

, In: 2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS),
Chae, Hyunsu ; Pan, David Z. ; Klivans, Adam... - p. 1-3 , 2023
Link: https://doi.org/10.1109/EPEPS58208.2023.10314912