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1 Ergebnisse
1
Signal Integrity Design and Analysis of Redistribution Laye..:
, In:
2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
,
Hong, Jonghyun
;
Yoon, Jiwon
;
Kim, Hyunwoo
... - p. 1-3 , 2023
Link:
https://doi.org/10.1109/EPEPS58208.2023.10314922
RT T1 <cTitle>2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)</cTitle>: T1 <Title>Signal Integrity Design and Analysis of Redistribution Layer Interposer Channel with Diagonal Meshed Ground in Memory Interface of High Bandwidth Memory</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10314922&Exemplar=1&LAN=DE A1 Hong, Jonghyun A1 Yoon, Jiwon A1 Kim, Hyunwoo A1 Son, Keeyoung A1 Choi, Seonguk A1 Lee, Junghyun A1 Kim, Keunwoo A1 Park, Joonsang A1 Kim, Seongguk A1 Sim, Boogyo A1 Kim, Joungho YR 2023 SN 2165-4115 K1 Time-frequency analysis K1 Costs K1 Crosstalk K1 Voltage K1 Bandwidth K1 Insertion loss K1 Impedance K1 high bandwidth memory (HBM) K1 overshoot voltage K1 RDL Interposer K1 signal integrity (SI) SP 1 OP 3 LK http://dx.doi.org/https://doi.org/10.1109/EPEPS58208.2023.10314922 DO https://doi.org/10.1109/EPEPS58208.2023.10314922 SF ELIB - SuUB Bremen
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