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Broadband RF Interconnects in a Multi-Layer Advanced Packag..:

, In: 2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS),
Mvokany, Sofia ; Molles, Jack ; Popovic, Zoya - p. 1-3 , 2023
Link: https://doi.org/10.1109/EPEPS58208.2023.10314924