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Analyses of Via-In-Pad Plated Over (VIPPO) and Dogbone in F..:

, In: 2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS),
Zhang, Yanyan ; Tang, Junyan ; Duan, Xiaomin... - p. 1-3 , 2023
Link: https://doi.org/10.1109/EPEPS58208.2023.10314951