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1 Ergebnisse
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Analyses of Via-In-Pad Plated Over (VIPPO) and Dogbone in F..:
, In:
2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
,
Zhang, Yanyan
;
Tang, Junyan
;
Duan, Xiaomin
... - p. 1-3 , 2023
Link:
https://doi.org/10.1109/EPEPS58208.2023.10314951
RT T1
2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
: T1
Analyses of Via-In-Pad Plated Over (VIPPO) and Dogbone in Fanout Routing High-Density Interconnects
UL https://suche.suub.uni-bremen.de/peid=ieee-10314951&Exemplar=1&LAN=DE A1 Zhang, Yanyan A1 Tang, Junyan A1 Duan, Xiaomin A1 Datta, Srijan A1 Paladhi, Pavel R. A1 Bohra, Mahesh A1 Chun, Sungjun A1 Dreps, Daniel M. YR 2023 SN 2165-4115 K1 Couplings K1 Measurement K1 Impedance matching K1 Crosstalk K1 Bandwidth K1 Jitter K1 Routing SP 1 OP 3 LK http://dx.doi.org/https://doi.org/10.1109/EPEPS58208.2023.10314951 DO https://doi.org/10.1109/EPEPS58208.2023.10314951 SF ELIB - SuUB Bremen
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