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1 Ergebnisse
1
Efficient Boundary Element Methodology for Analyzing Interc..:
, In:
2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
,
Bianconi, Giacomo
;
de Araujo, Daniel
;
Pingenot, James
. - p. 1-3 , 2023
Link:
https://doi.org/10.1109/EPEPS58208.2023.10314956
RT T1
2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
: T1
Efficient Boundary Element Methodology for Analyzing Interconnects in Multilayered PCBs
UL https://suche.suub.uni-bremen.de/peid=ieee-10314956&Exemplar=1&LAN=DE A1 Bianconi, Giacomo A1 de Araujo, Daniel A1 Pingenot, James A1 Chakraborty, Swagato YR 2023 SN 2165-4115 K1 Transmission line matrix methods K1 Printed circuits K1 Integrated circuit interconnections K1 Metals K1 Benchmark testing K1 Packaging K1 Stability analysis K1 Multilayered Green's function K1 magnetic current K1 method of moments K1 domain decomposition K1 measurement correlation SP 1 OP 3 LK http://dx.doi.org/https://doi.org/10.1109/EPEPS58208.2023.10314956 DO https://doi.org/10.1109/EPEPS58208.2023.10314956 SF ELIB - SuUB Bremen
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