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1 Ergebnisse
1
Textile SIW Structures Without Via Holes Using Self-Adhesiv..:
, In:
2023 16th International Conference on Advanced Technologies, Systems and Services in Telecommunications (TELSIKS)
,
Nesic, Dusan
;
Tanaskovic, Dragan
;
Vorkapic, Milos
- p. 37-39 , 2023
Link:
https://doi.org/10.1109/TELSIKS57806.2023.10316026
RT T1 <cTitle>2023 16th International Conference on Advanced Technologies, Systems and Services in Telecommunications (TELSIKS)</cTitle>: T1 <Title>Textile SIW Structures Without Via Holes Using Self-Adhesive Conductive Tapes</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10316026&Exemplar=1&LAN=DE A1 Nesic, Dusan A1 Tanaskovic, Dragan A1 Vorkapic, Milos YR 2023 K1 Photonic band gap K1 Telecommunications K1 Microstrip K1 Copper K1 Microwave filters K1 Yarn K1 Conductive adhesives K1 Microwave on textiles K1 SIW-Substrate Integrated Waveguide K1 Short-circuited edge K1 Self-adhesive conductive tapes SP 37 OP 39 LK http://dx.doi.org/https://doi.org/10.1109/TELSIKS57806.2023.10316026 DO https://doi.org/10.1109/TELSIKS57806.2023.10316026 SF ELIB - SuUB Bremen
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