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1
Limitations on Pitch Design due to Thermal Crosstalk in Pr1..:
, In:
2023 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)
,
Uttarwar, Ujwal
;
Kaushik, Kunal
;
Sakhuja, Jayatika
... - p. 25-28 , 2023
Link:
https://doi.org/10.23919/SISPAD57422.2023.10319638
RT T1 <cTitle>2023 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)</cTitle>: T1 <Title>Limitations on Pitch Design due to Thermal Crosstalk in Pr1-xCaxMnO3 RRAM Crossbar Arrays</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10319638&Exemplar=1&LAN=DE A1 Uttarwar, Ujwal A1 Kaushik, Kunal A1 Sakhuja, Jayatika A1 Saraswat, Vivek A1 Lashkare, Sandip A1 Ganguly, Udayan YR 2023 K1 Performance evaluation K1 Heating systems K1 Perturbation methods K1 Memory management K1 Crosstalk K1 Memristors K1 Machine learning K1 PCMO K1 RRAM K1 thermal crosstalk K1 crossbar arrays K1 MAC SP 25 OP 28 LK http://dx.doi.org/https://doi.org/10.23919/SISPAD57422.2023.10319638 DO https://doi.org/10.23919/SISPAD57422.2023.10319638 SF ELIB - SuUB Bremen
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