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Floorplanning for Embedded Multi-Die Interconnect Bridge Pa..:

, In: 2023 IEEE/ACM International Conference on Computer Aided Design (ICCAD),
Lee, Chung-Chia ; Chang, Yao-Wen - p. 1-8 , 2023
Link: https://doi.org/10.1109/ICCAD57390.2023.10323609