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1 Ergebnisse
1
Delay-Matching Routing for Advanced Packages:
, In:
2023 IEEE/ACM International Conference on Computer Aided Design (ICCAD)
,
Lee, Chun-An
;
Liu, Wen-Hao
;
Lin, Gary
. - p. 1-8 , 2023
Link:
https://doi.org/10.1109/ICCAD57390.2023.10323679
RT T1 <cTitle>2023 IEEE/ACM International Conference on Computer Aided Design (ICCAD)</cTitle>: T1 <Title>Delay-Matching Routing for Advanced Packages</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10323679&Exemplar=1&LAN=DE A1 Lee, Chun-An A1 Liu, Wen-Hao A1 Lin, Gary A1 Ho, Tsung-Yi YR 2023 SN 1558-2434 K1 Design automation K1 Costs K1 Wires K1 Printed circuits K1 Routing K1 Robustness K1 Delays SP 1 OP 8 LK http://dx.doi.org/https://doi.org/10.1109/ICCAD57390.2023.10323679 DO https://doi.org/10.1109/ICCAD57390.2023.10323679 SF ELIB - SuUB Bremen
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