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Investigation of Thermal Design Issues of a Bimaterial MEMS:
, In:
2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
,
Deak, E. David
;
Plesz, Balazs
;
Szabo, Peter G.
- p. 1-4 , 2023
Link:
https://doi.org/10.1109/THERMINIC60375.2023.10325870
RT T1
2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
: T1
Investigation of Thermal Design Issues of a Bimaterial MEMS
UL https://suche.suub.uni-bremen.de/peid=ieee-10325870&Exemplar=1&LAN=DE A1 Deak, E. David A1 Plesz, Balazs A1 Szabo, Peter G. YR 2023 SN 2474-1523 K1 Micromechanical devices K1 Microelectromechanical systems K1 Integrated circuits K1 Thermal expansion K1 Kelvin K1 Sensor systems and applications K1 Numerical simulation K1 MEMS K1 bimaterial K1 optimal out of plane displacement SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/THERMINIC60375.2023.10325870 DO https://doi.org/10.1109/THERMINIC60375.2023.10325870 SF ELIB - SuUB Bremen
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