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1
A Simple Electrothermal Compact Model for SiC MPS Diodes In..:
, In:
2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
,
d'Alessandro, Vincenzo
;
Terracciano, Vincenzo
;
Borghese, Alessandro
.. - p. 1-5 , 2023
Link:
https://doi.org/10.1109/THERMINIC60375.2023.10325871
RT T1 <cTitle>2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)</cTitle>: T1 <Title>A Simple Electrothermal Compact Model for SiC MPS Diodes Including the Snapback Mechanism</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10325871&Exemplar=1&LAN=DE A1 d'Alessandro, Vincenzo A1 Terracciano, Vincenzo A1 Borghese, Alessandro A1 Boccarossa, Marco A1 Irace, Andrea YR 2023 SN 2474-1523 K1 Integrated circuits K1 Silicon carbide K1 High-voltage techniques K1 SPICE K1 Semiconductor process modeling K1 Pins K1 Thermal analysis SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/THERMINIC60375.2023.10325871 DO https://doi.org/10.1109/THERMINIC60375.2023.10325871 SF ELIB - SuUB Bremen
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