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Improving the thermal ruggedness of GaAs HBTs through nonun..:
, In:
2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
,
Catalano, Antonio Pio
;
Scognamillo, Ciro
;
Zampardi, Peter J.
.. - p. 1-5 , 2023
Link:
https://doi.org/10.1109/THERMINIC60375.2023.10325872
RT T1
2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
: T1
Improving the thermal ruggedness of GaAs HBTs through nonuniform base ballasting optimization
UL https://suche.suub.uni-bremen.de/peid=ieee-10325872&Exemplar=1&LAN=DE A1 Catalano, Antonio Pio A1 Scognamillo, Ciro A1 Zampardi, Peter J. A1 Codecasa, Lorenzo A1 d'Alessandro, Vincenzo YR 2023 SN 2474-1523 K1 Resistors K1 Freeware K1 Temperature distribution K1 Electronic ballasts K1 Thermal resistance K1 Gallium arsenide K1 Bandwidth SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/THERMINIC60375.2023.10325872 DO https://doi.org/10.1109/THERMINIC60375.2023.10325872 SF ELIB - SuUB Bremen
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