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1 Ergebnisse
1
Observer based junction temperature estimation : 3D simulat..:
, In:
2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
,
Kabwangala, Tychique Nzalalemba
;
Fradin, Jean-Pierre
;
Ariba, Yassine
.. - p. 1-6 , 2023
Link:
https://doi.org/10.1109/THERMINIC60375.2023.10325885
RT T1
2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
: T1
Observer based junction temperature estimation : 3D simulations and experimentations
UL https://suche.suub.uni-bremen.de/peid=ieee-10325885&Exemplar=1&LAN=DE A1 Kabwangala, Tychique Nzalalemba A1 Fradin, Jean-Pierre A1 Ariba, Yassine A1 Marie, Alexandre A1 Gouaisbaut, Frederic YR 2023 SN 2474-1523 K1 Temperature measurement K1 Temperature sensors K1 Solid modeling K1 Semiconductor device measurement K1 Three-dimensional displays K1 Observers K1 Mathematical models K1 semiconductor K1 junction temperature monitoring K1 estimation K1 observer K1 automatic control SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/THERMINIC60375.2023.10325885 DO https://doi.org/10.1109/THERMINIC60375.2023.10325885 SF ELIB - SuUB Bremen
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