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Thermal Test Vehicle for HPC – System Level Approach for In..:

, In: 2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC),

Sternberg, Maik ; May, Daniel ; Pareek, Kaushal Arun... - p. 1-7 , 2023

Link: https://doi.org/10.1109/THERMINIC60375.2023.10325887

RT 
T1 <cTitle>2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)</cTitle>: T1 <Title>Thermal Test Vehicle for HPC – System Level Approach for Investigation of the Thermal Heat Path Signature with the Property of Spatial Resolution</Title>

UL https://suche.suub.uni-bremen.de/peid=ieee-10325887&Exemplar=1&LAN=DE
				
A1 Sternberg, Maik
A1 May, Daniel
A1 Pareek, Kaushal Arun
A1 Bader, Volker
A1 Becker, Karl-Friedrich
A1 Wunderle, Bernhard
A1 Ras, Mohamad Abo
YR 2023
SN 2474-1523
K1 Semiconductor device measurement
K1 Power system measurements
K1 Thermal resistance
K1 MIMICs
K1 Thermal conductivity
K1 Silicon
K1 Behavioral sciences
K1 Thermal Test Vehicle
K1 Thermal Test Chip
K1 Thermotest
K1 HPC
K1 Thermal Resistance
K1 Thermal Impedance
K1 Thermal-Transient Measurement
K1 Structure Function
K1 Large Die Area
K1 Flip Chip Package Assembly
SP 1
OP 7
LK http://dx.doi.org/https://doi.org/10.1109/THERMINIC60375.2023.10325887
DO https://doi.org/10.1109/THERMINIC60375.2023.10325887
SF ELIB - SuUB Bremen

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