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1 Ergebnisse
1
To bend or not to bend: Impact on heat pipe performance:
, In:
2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
,
Wits, Wessel W.
;
Groot, Rick
;
Jafari, Davoud
- p. 1-6 , 2023
Link:
https://doi.org/10.1109/THERMINIC60375.2023.10325908
RT T1
2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
: T1
To bend or not to bend: Impact on heat pipe performance
UL https://suche.suub.uni-bremen.de/peid=ieee-10325908&Exemplar=1&LAN=DE A1 Wits, Wessel W. A1 Groot, Rick A1 Jafari, Davoud YR 2023 SN 2474-1523 K1 Integrated circuits K1 Industries K1 Heat pipes K1 Bending K1 Thermal management K1 Reliability engineering K1 Thermal analysis K1 heat pipe K1 bending K1 inclination angle K1 capillary limit K1 thermal management K1 electronics cooling SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/THERMINIC60375.2023.10325908 DO https://doi.org/10.1109/THERMINIC60375.2023.10325908 SF ELIB - SuUB Bremen
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