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1 Ergebnisse
1
Analysis of Innovative 3D-Printed Direct Coolers for Modula..:
, In:
2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
,
Delmonte, Nicola
;
Cova, Paolo
;
Spaggiari, Davide
... - p. 1-4 , 2023
Link:
https://doi.org/10.1109/THERMINIC60375.2023.10325915
RT T1 <cTitle>2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)</cTitle>: T1 <Title>Analysis of Innovative 3D-Printed Direct Coolers for Modular Power Devices</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10325915&Exemplar=1&LAN=DE A1 Delmonte, Nicola A1 Cova, Paolo A1 Spaggiari, Davide A1 Santoro, Danilo A1 Sciancalepore, Corrado A1 Menozzi, Roberto YR 2023 SN 2474-1523 K1 Performance evaluation K1 Resistors K1 Solid modeling K1 Semiconductor device measurement K1 Three-dimensional displays K1 Thermal resistance K1 Multichip modules K1 Cold plate K1 3D printing K1 cooling K1 heat sinks K1 computational fluid dynamics (CFD) K1 jet impingement cooling SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/THERMINIC60375.2023.10325915 DO https://doi.org/10.1109/THERMINIC60375.2023.10325915 SF ELIB - SuUB Bremen
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