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1 Ergebnisse
1
Mobilint's ARIES: Chip for Edge AI:
, In:
2023 IEEE International Conference on Consumer Electronics-Asia (ICCE-Asia)
,
Oh, Youngrock
;
Jeon, Haeryong
;
Kim, Jisung
... - p. 1-4 , 2023
Link:
https://doi.org/10.1109/ICCE-Asia59966.2023.10326331
RT T1
2023 IEEE International Conference on Consumer Electronics-Asia (ICCE-Asia)
: T1
Mobilint's ARIES: Chip for Edge AI
UL https://suche.suub.uni-bremen.de/peid=ieee-10326331&Exemplar=1&LAN=DE A1 Oh, Youngrock A1 Jeon, Haeryong A1 Kim, Jisung A1 Han, Seunghak A1 Chung, Yunjeong A1 Asanbekov, Kanybek A1 Song, Gyuyoun A1 Han, Kibum A1 Kim, Junyeob A1 Lee, Junseong A1 Lee, Jeongseung A1 Park, Jongjun A1 Shin, Dongjoo YR 2023 K1 Performance evaluation K1 Deep learning K1 Costs K1 Smart cities K1 Data security K1 Energy conservation K1 AI accelerators K1 Deep learning accelerator K1 edge K1 AI SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/ICCE-Asia59966.2023.10326331 DO https://doi.org/10.1109/ICCE-Asia59966.2023.10326331 SF ELIB - SuUB Bremen
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