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1 Ergebnisse
1
Hardware-in-the-Loop Evaluation of Grid-Edge DER Chip Integ..:
, In:
2023 IEEE International Conference on Communications, Control, and Computing Technologies for Smart Grids (SmartGridComm)
,
Comden, Joshua
;
Wang, Jing
;
Ganguly, Subhankar
... - p. 1-6 , 2023
Link:
https://doi.org/10.1109/SmartGridComm57358.2023.103338..
RT T1 <cTitle>2023 IEEE International Conference on Communications, Control, and Computing Technologies for Smart Grids (SmartGridComm)</cTitle>: T1 <Title>Hardware-in-the-Loop Evaluation of Grid-Edge DER Chip Integration Into Next-Generation Smart Meters</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10333873&Exemplar=1&LAN=DE A1 Comden, Joshua A1 Wang, Jing A1 Ganguly, Subhankar A1 Forsyth, Steven A1 Gomez, Reynaldo A1 Bernstein, Andrey YR 2023 SN 2474-2902 K1 Meters K1 Hardware-in-the-loop simulation K1 Virtual power plants K1 Smart meters K1 Hardware K1 Smart grids K1 Voltage control SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/SmartGridComm57358.2023.10333873 DO https://doi.org/10.1109/SmartGridComm57358.2023.10333873 SF ELIB - SuUB Bremen
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