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1 Ergebnisse
1
FOWLP-Based Flexible Hybrid Electronics II: Heterogeneous I..:
, In:
2023 IEEE CPMT Symposium Japan (ICSJ)
,
Shen, Jiayi
;
Liu, Chang
;
Kino, Hisashi
.. - p. 49-52 , 2023
Link:
https://doi.org/10.1109/ICSJ59341.2023.10339585
RT T1
2023 IEEE CPMT Symposium Japan (ICSJ)
: T1
FOWLP-Based Flexible Hybrid Electronics II: Heterogeneous Integration Technology of Micro-LEDs on 3D-IC for Smart Skin Display
UL https://suche.suub.uni-bremen.de/peid=ieee-10339585&Exemplar=1&LAN=DE A1 Shen, Jiayi A1 Liu, Chang A1 Kino, Hisashi A1 Tanaka, Tetsu A1 Fukushima, Takafumi YR 2023 SN 2475-8418 K1 Silicon compounds K1 Multichip modules K1 Process control K1 Skin K1 Wafer scale integration K1 Bonding K1 Through-silicon vias K1 flexible hybrid electronics (FHE) K1 chiplet K1 heterogeneous integration K1 micro-LED K1 room-temperature Cu bonding K1 3D-IC/TSV SP 49 OP 52 LK http://dx.doi.org/https://doi.org/10.1109/ICSJ59341.2023.10339585 DO https://doi.org/10.1109/ICSJ59341.2023.10339585 SF ELIB - SuUB Bremen
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