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Thermal and Signal Integrity Improvement in a 3D RRAM Cross..:

, In: 2023 IEEE Nanotechnology Materials and Devices Conference (NMDC),
Lahbacha, Khitem ; Zayer, Fakhreddine ; Belgacem, Hamdi.. - p. 648-653 , 2023
Link: https://doi.org/10.1109/NMDC57951.2023.10343766