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1 Ergebnisse
1
3D-ISC: A 65nm 3D Compatible In-Sensor Computing Accelerato..:
, In:
2023 IEEE Asian Solid-State Circuits Conference (A-SSCC)
,
Krishnan, Gokul
;
Nair, Gopikrishnan Raveendran
;
Oh, Jonghyun
... - p. 1-3 , 2023
Link:
https://doi.org/10.1109/A-SSCC58667.2023.10347978
RT T1
2023 IEEE Asian Solid-State Circuits Conference (A-SSCC)
: T1
3D-ISC: A 65nm 3D Compatible In-Sensor Computing Accelerator with Reconfigurable Tile Architecture for Real-Time DVS Data Compression
UL https://suche.suub.uni-bremen.de/peid=ieee-10347978&Exemplar=1&LAN=DE A1 Krishnan, Gokul A1 Nair, Gopikrishnan Raveendran A1 Oh, Jonghyun A1 Anupreetham, Anupreetham A1 Nalla, Pragnya Sudershan A1 Hassan, Ahmed A1 Yeo, Injune A1 Kasichainula, Kishore A1 Seo, Jae-sun A1 Seok, Mingoo A1 Cao, Yu YR 2023 K1 Three-dimensional displays K1 Brightness K1 Integrated circuit interconnections K1 Data compression K1 Computer architecture K1 Vision sensors K1 Throughput SP 1 OP 3 LK http://dx.doi.org/https://doi.org/10.1109/A-SSCC58667.2023.10347978 DO https://doi.org/10.1109/A-SSCC58667.2023.10347978 SF ELIB - SuUB Bremen
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