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1
Reliability Performance Study of Molding Compounds on High ..:
, In:
2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
,
Garete, April Joy
;
Li, Zhiwen
;
Fung, Yee Wai
. - p. 67-70 , 2023
Link:
https://doi.org/10.1109/IMPACT59481.2023.10348634
RT T1 <cTitle>2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)</cTitle>: T1 <Title>Reliability Performance Study of Molding Compounds on High Voltage Molded Leaded Package</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10348634&Exemplar=1&LAN=DE A1 Garete, April Joy A1 Li, Zhiwen A1 Fung, Yee Wai A1 Wong, Wai Man YR 2023 SN 2150-5942 K1 Degradation K1 Performance evaluation K1 High-voltage techniques K1 Voltage K1 Conductivity K1 Ions K1 Electromagnetic compatibility K1 Molding Compound K1 High Voltage K1 HTRB K1 IMC K1 Leakage Current SP 67 OP 70 LK http://dx.doi.org/https://doi.org/10.1109/IMPACT59481.2023.10348634 DO https://doi.org/10.1109/IMPACT59481.2023.10348634 SF ELIB - SuUB Bremen
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