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1 Ergebnisse
1
Integration of Failure and Predictive Analytics for Root Ca..:
, In:
2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
,
Sharma, Pradeep
;
Li, Peggy
;
Hsieh, Jackal
... - p. 240-242 , 2023
Link:
https://doi.org/10.1109/IMPACT59481.2023.10348687
RT T1 <cTitle>2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)</cTitle>: T1 <Title>Integration of Failure and Predictive Analytics for Root Cause(s) of Early Lifetime Cracks in Ceramic Based Probe Card</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10348687&Exemplar=1&LAN=DE A1 Sharma, Pradeep A1 Li, Peggy A1 Hsieh, Jackal A1 Yang, CK A1 Faillaci, Steven A A1 Tsai, MF A1 Garrett, Doug A1 Cheng, Edmond A1 Chang, Paul YR 2023 SN 2150-5942 K1 Micromechanical devices K1 Semiconductor devices K1 Failure analysis K1 Packaging K1 Pins K1 Ceramics K1 Problem-solving K1 Wafer Testing K1 Probe Card K1 Early Lifetime Failures K1 Statistical Analysis K1 Predictive Data Analysis K1 Failure Analysis SP 240 OP 242 LK http://dx.doi.org/https://doi.org/10.1109/IMPACT59481.2023.10348687 DO https://doi.org/10.1109/IMPACT59481.2023.10348687 SF ELIB - SuUB Bremen
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