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1 Ergebnisse
1
A Study of Adhesion Enhancement for Porous Nickel Plating T..:
, In:
2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
,
Tsai, Yu-Ning
;
Fukuda, Chisa
;
Takahashi, Koya
... - p. 99-101 , 2023
Link:
https://doi.org/10.1109/IMPACT59481.2023.10348720
RT T1 <cTitle>2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)</cTitle>: T1 <Title>A Study of Adhesion Enhancement for Porous Nickel Plating Treated Surface</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10348720&Exemplar=1&LAN=DE A1 Tsai, Yu-Ning A1 Fukuda, Chisa A1 Takahashi, Koya A1 Takahashi, Yoshiko A1 Kawashiro, Fumiyoshi A1 Noda, Takamitsu YR 2023 SN 2150-5942 K1 Adhesives K1 Semiconductor devices K1 Surface morphology K1 Plating K1 Packaging K1 Electromagnetic compatibility K1 Nickel SP 99 OP 101 LK http://dx.doi.org/https://doi.org/10.1109/IMPACT59481.2023.10348720 DO https://doi.org/10.1109/IMPACT59481.2023.10348720 SF ELIB - SuUB Bremen
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