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Optimize Stencil Apertures to Eliminate SMT Solder Defects ..:

, In: 2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Hong, Ling-Ying ; Li, Yun-Tsung - p. 312-316 , 2023
Link: https://doi.org/10.1109/IMPACT59481.2023.10348729