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Simulation Modeling of 600mm X600mm Fan-Out Panel Level for..:

, In: 2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Cheng, Kuo-Ching ; Chen, Bo-Heng ; Chen, Cong-Wei... - p. 46-49 , 2023
Link: https://doi.org/10.1109/IMPACT59481.2023.10348732