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1 Ergebnisse
1
Combining Process Modeling and Machine Learning Technology ..:
, In:
2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
,
Chen, Y.C.
;
Chen, H. L.
;
Chiang, K.N.
- p. 54-58 , 2023
Link:
https://doi.org/10.1109/IMPACT59481.2023.10348737
RT T1 <cTitle>2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)</cTitle>: T1 <Title>Combining Process Modeling and Machine Learning Technology to Predict the Warpage of the Panel-Level Packaging After Debonding</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10348737&Exemplar=1&LAN=DE A1 Chen, Y.C. A1 Chen, H. L. A1 Chiang, K.N. YR 2023 SN 2150-5942 K1 Training K1 Uncertainty K1 Artificial neural networks K1 Machine learning K1 Predictive models K1 Packaging K1 Finite element analysis K1 Fan-Out Panel-Level Packaging K1 Finite Element Method K1 Process Modeling Technology K1 Debonding Process K1 Asymmetric Warpage K1 Machine Learning K1 Artificial Neural Network SP 54 OP 58 LK http://dx.doi.org/https://doi.org/10.1109/IMPACT59481.2023.10348737 DO https://doi.org/10.1109/IMPACT59481.2023.10348737 SF ELIB - SuUB Bremen
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