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Enhancement of Thermal cycle and Drop Shock Reliability at ..:

, In: 2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Son, J.Y. ; Lee, S.G. ; Park, J.W... - p. 106-110 , 2023
Link: https://doi.org/10.1109/IMPACT59481.2023.10348757