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1 Ergebnisse
1
Alternative 3D Double Side Molded SiP for 5G Communication:
, In:
2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
,
Yang, Shen-Yu
;
Tong, Yu-Wen
;
Lin, Jing-Jun
... - p. 78-81 , 2023
Link:
https://doi.org/10.1109/IMPACT59481.2023.10348770
RT T1 <cTitle>2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)</cTitle>: T1 <Title>Alternative 3D Double Side Molded SiP for 5G Communication</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10348770&Exemplar=1&LAN=DE A1 Yang, Shen-Yu A1 Tong, Yu-Wen A1 Lin, Jing-Jun A1 Yang, Jui-Hao A1 Peng, Chih-Hung A1 Chan, Chao-Chieh YR 2023 SN 2150-5942 K1 Three-dimensional displays K1 Vacuum systems K1 System-in-package K1 Dams K1 5G mobile communication K1 Electromagnetic interference K1 Surface mount technology K1 3D SiP K1 Double side molding K1 VPES K1 Conductive dam K1 EMI shielding SP 78 OP 81 LK http://dx.doi.org/https://doi.org/10.1109/IMPACT59481.2023.10348770 DO https://doi.org/10.1109/IMPACT59481.2023.10348770 SF ELIB - SuUB Bremen
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