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1 Ergebnisse
1
Micro-Defect Failure Analysis in Fan-Out Package and Corres..:
, In:
2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
,
Chang, Yu-Jen
;
Hsiao, Yu-Hsiang
;
Lin, Yi-Sheng
. - p. 327-329 , 2023
Link:
https://doi.org/10.1109/IMPACT59481.2023.10348782
RT T1 <cTitle>2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)</cTitle>: T1 <Title>Micro-Defect Failure Analysis in Fan-Out Package and Correspond to Finite Element Method (FEM) Simulation Results</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10348782&Exemplar=1&LAN=DE A1 Chang, Yu-Jen A1 Hsiao, Yu-Hsiang A1 Lin, Yi-Sheng A1 Yin, Wei-Jie YR 2023 SN 2150-5942 K1 Micromechanical devices K1 Three-dimensional displays K1 Simulation K1 Microscopy K1 Failure analysis K1 Multichip modules K1 Finite element analysis SP 327 OP 329 LK http://dx.doi.org/https://doi.org/10.1109/IMPACT59481.2023.10348782 DO https://doi.org/10.1109/IMPACT59481.2023.10348782 SF ELIB - SuUB Bremen
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