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1 Ergebnisse
1
Printed Circuit Board (PCB) Design Electrical Characterizat..:
, In:
2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
,
Zan, Mengen
;
Hou, Shaozheng
;
Hu, Yuanming
... - p. 255-258 , 2023
Link:
https://doi.org/10.1109/IMPACT59481.2023.10348803
RT T1 <cTitle>2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)</cTitle>: T1 <Title>Printed Circuit Board (PCB) Design Electrical Characterization and Optimization in Immersion Cooling Environment</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10348803&Exemplar=1&LAN=DE A1 Zan, Mengen A1 Hou, Shaozheng A1 Hu, Yuanming A1 Fan, Yibo A1 Ju, Huafang A1 Hsu, Jimmy A1 Ren, Yinglei A1 Deng, Lili YR 2023 SN 2150-5942 K1 Micromechanical devices K1 Liquids K1 Printed circuits K1 Immersion cooling K1 Packaging K1 Microstrip components K1 Reflection SP 255 OP 258 LK http://dx.doi.org/https://doi.org/10.1109/IMPACT59481.2023.10348803 DO https://doi.org/10.1109/IMPACT59481.2023.10348803 SF ELIB - SuUB Bremen
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