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Mitigate Package Level Crosstalk Using Tabbed Design:

, In: 2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Tsai, Cheng-Yu ; Kuo, Hung-Chun ; Jhong, Ming-Fong. - p. 237-239 , 2023
Link: https://doi.org/10.1109/IMPACT59481.2023.10348815