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1 Ergebnisse
1
High-speed Channel Design and Correlation Between Signal In..:
, In:
2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
,
Ho, Brian
;
Ho, Chiew Yee
;
Hsu, Jimmy
. - p. 298-301 , 2023
Link:
https://doi.org/10.1109/IMPACT59481.2023.10348822
RT T1 <cTitle>2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)</cTitle>: T1 <Title>High-speed Channel Design and Correlation Between Signal Integrity and Electrical Validation of Datacenter Platforms</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10348822&Exemplar=1&LAN=DE A1 Ho, Brian A1 Ho, Chiew Yee A1 Hsu, Jimmy A1 Wu, Kuan-Ting YR 2023 SN 2150-5942 K1 Micromechanical devices K1 Correlation K1 Bit error rate K1 Merging K1 Electric variables measurement K1 Receivers K1 Packaging SP 298 OP 301 LK http://dx.doi.org/https://doi.org/10.1109/IMPACT59481.2023.10348822 DO https://doi.org/10.1109/IMPACT59481.2023.10348822 SF ELIB - SuUB Bremen
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