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1 Ergebnisse
1
Quick Assessment Methodology for Thermal Impedance Predicti..:
, In:
2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
,
Lai, Jin Yuan
;
Yang, Shin Yueh
;
Ong, Yeow Chon
.. - p. 191-194 , 2023
Link:
https://doi.org/10.1109/IMPACT59481.2023.10348833
RT T1 <cTitle>2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)</cTitle>: T1 <Title>Quick Assessment Methodology for Thermal Impedance Prediction Apply to IC Package</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10348833&Exemplar=1&LAN=DE A1 Lai, Jin Yuan A1 Yang, Shin Yueh A1 Ong, Yeow Chon A1 Che, Fa Xing A1 Ng, Hong Wan YR 2023 SN 2150-5942 K1 Thermal resistance K1 Simulation K1 Predictive models K1 Electronic packaging thermal management K1 Thermal management K1 Mathematical models K1 Thermal analysis SP 191 OP 194 LK http://dx.doi.org/https://doi.org/10.1109/IMPACT59481.2023.10348833 DO https://doi.org/10.1109/IMPACT59481.2023.10348833 SF ELIB - SuUB Bremen
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