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1 Ergebnisse
1
Evaluation of High-Speed Signal Transmission Characteristic..:
, In:
2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
,
Song, Eakhwan
;
Sim, Changhoon
;
Lee, Kyungsub
... - p. 171-173 , 2023
Link:
https://doi.org/10.1109/IMPACT59481.2023.10348835
RT T1 <cTitle>2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)</cTitle>: T1 <Title>Evaluation of High-Speed Signal Transmission Characteristics of Self-Assembling Anisotropic Conductive Adhesives (SACA)</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10348835&Exemplar=1&LAN=DE A1 Song, Eakhwan A1 Sim, Changhoon A1 Lee, Kyungsub A1 Ha, Tai Woong A1 Lee, Sanguk A1 Kim, Jiseong YR 2023 SN 2150-5942 K1 Semiconductor device measurement K1 System-in-package K1 Anisotropic conductive films K1 Streaming media K1 Universal Serial Bus K1 Silicon K1 Bonding SP 171 OP 173 LK http://dx.doi.org/https://doi.org/10.1109/IMPACT59481.2023.10348835 DO https://doi.org/10.1109/IMPACT59481.2023.10348835 SF ELIB - SuUB Bremen
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