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1 Ergebnisse
1
Use Artificial Neural Network to fit stress-strain curve of..:
, In:
2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
,
Lee, C.E.
;
Yuan, Cadmus
;
Chiang, K.N.
- p. 137-142 , 2023
Link:
https://doi.org/10.1109/IMPACT59481.2023.10348841
RT T1 <cTitle>2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)</cTitle>: T1 <Title>Use Artificial Neural Network to fit stress-strain curve of Chaboche model on lead-free solder SAC305</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10348841&Exemplar=1&LAN=DE A1 Lee, C.E. A1 Yuan, Cadmus A1 Chiang, K.N. YR 2023 SN 2150-5942 K1 Semiconductor device modeling K1 Analytical models K1 Simulation K1 Artificial neural networks K1 Mathematical models K1 Finite element analysis K1 Integrated circuit modeling K1 Wafer Level Chip Scale Packaging K1 Finite Element Method K1 Chaboche Kinematic Hardening Model K1 curve fitting K1 Machine Learning K1 Artificial Neural Network SP 137 OP 142 LK http://dx.doi.org/https://doi.org/10.1109/IMPACT59481.2023.10348841 DO https://doi.org/10.1109/IMPACT59481.2023.10348841 SF ELIB - SuUB Bremen
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