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A New Flex Electroless Nickel Chemistry for Flex ENIG and E..:

, In: 2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Xu, Frank ; Iyer, Aparna ; Bunce, Martin.. - p. 243-246 , 2023
Link: https://doi.org/10.1109/IMPACT59481.2023.10348857