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1 Ergebnisse
1
An Effective Uniformity Improvement For Fan-Out Panel Level..:
, In:
2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
,
Liao, Chin-Ting
;
Wu, Boyin
;
Kuo, Mingtzung
... - p. 38-41 , 2023
Link:
https://doi.org/10.1109/IMPACT59481.2023.10348865
RT T1 <cTitle>2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)</cTitle>: T1 <Title>An Effective Uniformity Improvement For Fan-Out Panel Level Packaging Electroplating</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10348865&Exemplar=1&LAN=DE A1 Liao, Chin-Ting A1 Wu, Boyin A1 Kuo, Mingtzung A1 Chang, Ling-yuan A1 Wang, Burnet A1 Yang, Jeffrey A1 Fang, Jen-Kuang YR 2023 SN 2150-5942 K1 Industries K1 Micromechanical devices K1 Costs K1 Multichip modules K1 Packaging K1 Plating K1 Hardware SP 38 OP 41 LK http://dx.doi.org/https://doi.org/10.1109/IMPACT59481.2023.10348865 DO https://doi.org/10.1109/IMPACT59481.2023.10348865 SF ELIB - SuUB Bremen
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