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1 Ergebnisse
1
Low Contact Resistance and Low Temperature Hybrid Bonding w..:
, In:
2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
,
He, Pin-Syuan
;
Shie, Kai-Cheng
;
Chen, Chih
- p. 321-323 , 2023
Link:
https://doi.org/10.1109/IMPACT59481.2023.10348873
RT T1 <cTitle>2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)</cTitle>: T1 <Title>Low Contact Resistance and Low Temperature Hybrid Bonding with Polyimide and Highly -oriented Nanotwinned Cu</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10348873&Exemplar=1&LAN=DE A1 He, Pin-Syuan A1 Shie, Kai-Cheng A1 Chen, Chih YR 2023 SN 2150-5942 K1 Costs K1 Temperature K1 Surface resistance K1 Thermal resistance K1 Polyimides K1 Curing K1 Contact resistance SP 321 OP 323 LK http://dx.doi.org/https://doi.org/10.1109/IMPACT59481.2023.10348873 DO https://doi.org/10.1109/IMPACT59481.2023.10348873 SF ELIB - SuUB Bremen
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