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1 Ergebnisse
1
All-Solution-Processed Metallization of High Aspect Ratio T..:
, In:
2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
,
Chang, Yiu-Hsiang
;
Wang, Wei-Yen
;
Tseng, Pei-Lien
... - p. 251-254 , 2023
Link:
https://doi.org/10.1109/IMPACT59481.2023.10348880
RT T1 <cTitle>2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)</cTitle>: T1 <Title>All-Solution-Processed Metallization of High Aspect Ratio Through Glass Vias (HAR-TGVs) with a High Adhesion Promoting Layer (APL)</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10348880&Exemplar=1&LAN=DE A1 Chang, Yiu-Hsiang A1 Wang, Wei-Yen A1 Tseng, Pei-Lien A1 Kanungo, Mandakini A1 Pollard, Scott C. A1 Mazumder, Prantik YR 2023 SN 2150-5942 K1 Micromechanical devices K1 Metallization K1 Adhesives K1 Thermal shock K1 Glass K1 Packaging K1 Filling SP 251 OP 254 LK http://dx.doi.org/https://doi.org/10.1109/IMPACT59481.2023.10348880 DO https://doi.org/10.1109/IMPACT59481.2023.10348880 SF ELIB - SuUB Bremen
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