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1 Ergebnisse
1
Comprehensive study on the reliability of IGBT module bondi..:
, In:
2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
,
Hsieh, H.K
;
Lu, Y.Y.
;
Hsu, M.Y.
.. - p. 63-66 , 2023
Link:
https://doi.org/10.1109/IMPACT59481.2023.10348908
RT T1 <cTitle>2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)</cTitle>: T1 <Title>Comprehensive study on the reliability of IGBT module bonding process on the surface microstructure of heat dissipation substrate</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10348908&Exemplar=1&LAN=DE A1 Hsieh, H.K A1 Lu, Y.Y. A1 Hsu, M.Y. A1 Huang, C.W. A1 Pan, M.Y. YR 2023 SN 2150-5942 K1 Scanning electron microscopy K1 Surface morphology K1 Metals K1 Silicon nitride K1 Surface roughness K1 Rough surfaces K1 Microstructure SP 63 OP 66 LK http://dx.doi.org/https://doi.org/10.1109/IMPACT59481.2023.10348908 DO https://doi.org/10.1109/IMPACT59481.2023.10348908 SF ELIB - SuUB Bremen
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