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1 Ergebnisse
1
A novel surface finish can achieve robustness against coppe..:
, In:
2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
,
Shah, Kunal
;
Lee, Dem
;
Lee, Jeffrey
- p. 126-132 , 2023
Link:
https://doi.org/10.1109/IMPACT59481.2023.10348915
RT T1 <cTitle>2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)</cTitle>: T1 <Title>A novel surface finish can achieve robustness against copper creep corrosion for better reliability of Printed Circuit Boards (PCBs)</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10348915&Exemplar=1&LAN=DE A1 Shah, Kunal A1 Lee, Dem A1 Lee, Jeffrey YR 2023 SN 2150-5942 K1 Corrosion K1 Creep K1 Printed circuits K1 Life estimation K1 Insertion loss K1 Robustness K1 Hardware SP 126 OP 132 LK http://dx.doi.org/https://doi.org/10.1109/IMPACT59481.2023.10348915 DO https://doi.org/10.1109/IMPACT59481.2023.10348915 SF ELIB - SuUB Bremen
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