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1
Enhancement of 8 Leads Small Outline Integrated Circuit Pac..:
, In:
2023 Research, Invention, and Innovation Congress: Innovative Electricals and Electronics (RI2C)
,
Maneeroth, Nawapat
;
Ugsornrat, Kessararat
;
Sumithpibul, Chalermsak
- p. 273-275 , 2023
Link:
https://doi.org/10.1109/RI2C60382.2023.10355969
RT T1 <cTitle>2023 Research, Invention, and Innovation Congress: Innovative Electricals and Electronics (RI2C)</cTitle>: T1 <Title>Enhancement of 8 Leads Small Outline Integrated Circuit Package with AuPd Coated Cu Wire Bonding for Automotive Devices</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10355969&Exemplar=1&LAN=DE A1 Maneeroth, Nawapat A1 Ugsornrat, Kessararat A1 Sumithpibul, Chalermsak YR 2023 K1 Integrated circuits K1 Gold K1 Impurities K1 Wires K1 Reliability K1 Copper K1 Integrated circuit reliability K1 AuPd coated Cu wire K1 Integrated circuit package K1 Small Outline Integrated Circuit Package (SOIC) K1 Wire bonding process K1 Automotive SP 273 OP 275 LK http://dx.doi.org/https://doi.org/10.1109/RI2C60382.2023.10355969 DO https://doi.org/10.1109/RI2C60382.2023.10355969 SF ELIB - SuUB Bremen
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