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1 Ergebnisse
1
A Double-sided Flip chip SiC Power Module with a Novel Flip..:
, In:
2023 IEEE Energy Conversion Congress and Exposition (ECCE)
,
Ma, Liangjun
;
Zhang, Hong
;
Li, Lei
... - p. 5888-5894 , 2023
Link:
https://doi.org/10.1109/ECCE53617.2023.10362009
RT T1
2023 IEEE Energy Conversion Congress and Exposition (ECCE)
: T1
A Double-sided Flip chip SiC Power Module with a Novel Flip Chip Method On DBC By PTFE Coating
UL https://suche.suub.uni-bremen.de/peid=ieee-10362009&Exemplar=1&LAN=DE A1 Ma, Liangjun A1 Zhang, Hong A1 Li, Lei A1 Yuan, Tianshu A1 Ma, Dingkun A1 Yao, Yilong A1 Gao, Kai A1 Wang, Laili YR 2023 SN 2329-3748 K1 Partial discharges K1 Insulation K1 Inductance K1 Voltage measurement K1 Silicon carbide K1 Multichip modules K1 Coatings K1 SiC Power Module K1 PTFE Coating K1 Flip Chip K1 Double-sided cooling SP 5888 OP 5894 LK http://dx.doi.org/https://doi.org/10.1109/ECCE53617.2023.10362009 DO https://doi.org/10.1109/ECCE53617.2023.10362009 SF ELIB - SuUB Bremen
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