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1 Ergebnisse
1
Origin of Common Source Inductance in Power Device Packages..:
, In:
2023 IEEE Energy Conversion Congress and Exposition (ECCE)
,
Kobashi, Kotaro
;
Konishi, Akihiro
;
Umetani, Kazuhiro
... - p. 5510-5510 , 2023
Link:
https://doi.org/10.1109/ECCE53617.2023.10362400
RT T1 <cTitle>2023 IEEE Energy Conversion Congress and Exposition (ECCE)</cTitle>: T1 <Title>Origin of Common Source Inductance in Power Device Packages with Kelvin Source Terminal</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10362400&Exemplar=1&LAN=DE A1 Kobashi, Kotaro A1 Konishi, Akihiro A1 Umetani, Kazuhiro A1 Ishihara, Masataka A1 Hayashi, Takuto A1 Hiraki, Eiji YR 2023 SN 2329-3748 K1 Inductance K1 Semiconductor device measurement K1 Current measurement K1 Magnetic separation K1 Wires K1 Switches K1 Bonding K1 common source inductance K1 SiC-MOSFET K1 power semiconductor K1 parasitic inductance SP 5510 OP 5510 LK http://dx.doi.org/https://doi.org/10.1109/ECCE53617.2023.10362400 DO https://doi.org/10.1109/ECCE53617.2023.10362400 SF ELIB - SuUB Bremen
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