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1 Ergebnisse
1
The Design of Bidirectional Active Balun Chip Based on Powe..:
, In:
2023 8th International Conference on Integrated Circuits and Microsystems (ICICM)
,
Zhang, Meng
;
Ning, Guoyong
;
Pu, Chao
... - p. 497-501 , 2023
Link:
https://doi.org/10.1109/ICICM59499.2023.10365803
RT T1
2023 8th International Conference on Integrated Circuits and Microsystems (ICICM)
: T1
The Design of Bidirectional Active Balun Chip Based on Power Modulation
UL https://suche.suub.uni-bremen.de/peid=ieee-10365803&Exemplar=1&LAN=DE A1 Zhang, Meng A1 Ning, Guoyong A1 Pu, Chao A1 Zhang, Qi A1 Song, Yayun A1 Gao, Jian YR 2023 K1 Micromechanical devices K1 Integrated circuits K1 Temperature distribution K1 Inductance K1 Baluns K1 Simulation K1 Linearity K1 power modulation K1 active Balun K1 differential signal K1 bidirectional conversion SP 497 OP 501 LK http://dx.doi.org/https://doi.org/10.1109/ICICM59499.2023.10365803 DO https://doi.org/10.1109/ICICM59499.2023.10365803 SF ELIB - SuUB Bremen
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