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1 Ergebnisse
1
Interconnect Reliability Simulation Analysis of Fan-out Pac..:
, In:
2023 8th International Conference on Integrated Circuits and Microsystems (ICICM)
,
Fan, Yifeng
;
Tian, Shuang
;
Jiao, Honghao
... - p. 98-104 , 2023
Link:
https://doi.org/10.1109/ICICM59499.2023.10365829
RT T1 <cTitle>2023 8th International Conference on Integrated Circuits and Microsystems (ICICM)</cTitle>: T1 <Title>Interconnect Reliability Simulation Analysis of Fan-out Package redistribution Layer</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10365829&Exemplar=1&LAN=DE A1 Fan, Yifeng A1 Tian, Shuang A1 Jiao, Honghao A1 Meng, Dexi A1 Wang, Zhibin A1 Meng, Meng YR 2023 K1 Micromechanical devices K1 Simulation K1 Integrated circuit interconnections K1 Aerospace electronics K1 Reliability engineering K1 Finite element analysis K1 Integrated circuit reliability K1 fan-out package K1 redistribution layer K1 CTE mismatch K1 finite element simulation SP 98 OP 104 LK http://dx.doi.org/https://doi.org/10.1109/ICICM59499.2023.10365829 DO https://doi.org/10.1109/ICICM59499.2023.10365829 SF ELIB - SuUB Bremen
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